Búsqueda
Español
Título
  • English
  • 正體中文
  • 简体中文
  • Deutsch
  • Español
  • Français
  • Magyar
  • 日本語
  • 한국어
  • Монгол хэл
  • Âu Lạc
  • български
  • bahasa Melayu
  • فارسی
  • Português
  • Română
  • Bahasa Indonesia
  • ไทย
  • العربية
  • čeština
  • ਪੰਜਾਬੀ
  • русский
  • తెలుగు లిపి
  • हिन्दी
  • polski
  • italiano
  • Wikang Tagalog
  • Українська Мова
  • Others
  • English
  • 正體中文
  • 简体中文
  • Deutsch
  • Español
  • Français
  • Magyar
  • 日本語
  • 한국어
  • Монгол хэл
  • Âu Lạc
  • български
  • bahasa Melayu
  • فارسی
  • Português
  • Română
  • Bahasa Indonesia
  • ไทย
  • العربية
  • čeština
  • ਪੰਜਾਬੀ
  • русский
  • తెలుగు లిపి
  • हिन्दी
  • polski
  • italiano
  • Wikang Tagalog
  • Українська Мова
  • Others
Título
Transcripción
A continuación
 

Trascendiendo los Límites de la Fabricación de Microchips: Litografía Extrema UV, Parte 2 de 2

2018-11-03
Idioma:English,Korean (한국어),Mandarin Chinese (中文)
Información
Descargar Docx
Leer más
In the coming years, the application of microchips will continue to expand, the demand for chips will also continue to grow. However, the traditional 193 nm lithography has reached its limit and must be replaced with its 13.5 nm EUV counterpart. It is generally agreed that EUV lithography is the most difficult technology to perfect in the history of the semiconductor industry — so challenging that it is comparable to NASA’s Moon landing project.
Compartir
Compartir con
Insertar
Empezar en
Descargar
Móvil
Móvil
iPhone
Android
Ver en navegador móvil
GO
GO
Prompt
OK
Aplicación
Escanee el código QR o elija el sistema telefónico adecuada para descargar
iPhone
Android